Invention Grant
US08278180B2 Methods of forming a semiconductor device having a contact structure
有权
形成具有接触结构的半导体器件的方法
- Patent Title: Methods of forming a semiconductor device having a contact structure
- Patent Title (中): 形成具有接触结构的半导体器件的方法
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Application No.: US12871273Application Date: 2010-08-30
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Publication No.: US08278180B2Publication Date: 2012-10-02
- Inventor: Changhun Lee , Keemoon Chun
- Applicant: Changhun Lee , Keemoon Chun
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2009-0128919 20091222
- Main IPC: H01L21/331
- IPC: H01L21/331 ; H01L21/461 ; H01L21/302

Abstract:
A method of forming a semiconductor device having a contact structure includes forming an insulating layer on a semiconductor substrate, and selectively implanting impurity ions into a predetermined region of the insulating layer to generate lattice defects in the predetermined region of the insulating layer. A thermal treatment, such as quenching the insulating layer at a temperature change rate of at least −20° C./minute, is performed on the insulating layer having the lattice defects to accelerate generation of the lattice defects in the predetermined region such that a conductive region results from the generated lattice defects to provide current paths in the predetermined region.
Public/Granted literature
- US20110151658A1 Methods of Forming a Semiconductor Device Having a Contact Structure Public/Granted day:2011-06-23
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