Invention Grant
- Patent Title: Semiconductor device and method of producing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12860409Application Date: 2010-08-20
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Publication No.: US08278198B2Publication Date: 2012-10-02
- Inventor: Yuuki Doi , Hirokazu Fujimaki
- Applicant: Yuuki Doi , Hirokazu Fujimaki
- Applicant Address: JP Tokyo
- Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee: Oki Semiconductor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kubotera & Associates, LLC
- Priority: JP2009-191545 20090821
- Main IPC: H01L21/425
- IPC: H01L21/425

Abstract:
A method of producing a Schottky diode includes the steps of: forming a resist layer on the semiconductor substrate; performing a first exposure process on the resist layer; performing a first developing process for developing the resist layer to form a first Schottky diode having an excess region; performing a first cleaning process; performing a second exposure process on the first Schottky diode; performing a second developing process on the first Schottky diode to remove the excess region from the first Schottky diode so that a second Schottky diode corresponding to the specific Schottky diode is formed; and performing a second cleaning process.
Public/Granted literature
- US20110042775A1 SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME Public/Granted day:2011-02-24
Information query
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