Invention Grant
- Patent Title: Method for forming hole pattern
- Patent Title (中): 孔图案形成方法
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Application No.: US12777758Application Date: 2010-05-11
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Publication No.: US08278223B2Publication Date: 2012-10-02
- Inventor: Sang-Kil Kang
- Applicant: Sang-Kil Kang
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2010-0004059 20100115
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
A method for forming a hole pattern includes forming a hard mask layer for a hole pattern over an etch target layer, forming pillar patterns having a gap therebetween over the hard mask layer for a hole pattern, forming spacer patterns on sidewalls of the pillar patterns, removing the pillar patterns between the spacer patterns, and etching the hard mask layer for a hole pattern by using the spacer patterns as etch barriers.
Public/Granted literature
- US20110177691A1 METHOD FOR FORMING HOLE PATTERN Public/Granted day:2011-07-21
Information query
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