The invention provides a resin composition for laser engraving, containing at least (A) a polymerizable compound having two or more ethylenic unsaturated bonds, a carbon-sulfur bond being contained at the site where two among the two or more ethylenic unsaturated bonds are connected and (B) a binder polymer. The invention further provides an image forming material containing the resin composition, a relief printing plate precursor having a relief forming layer which contains the resin composition, a relief printing plate precursor having a relief forming layer which contains a product formed by subjecting the resin composition to cross-linking, a method for manufacturing a relief printing plate including subjecting the relief printing plate precursor having the relief forming layer which contains the resin composition to cross-linking, and a relief printing plate manufactured by the manufacturing method.