Invention Grant
- Patent Title: Resin composition
- Patent Title (中): 树脂组成
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Application No.: US13055099Application Date: 2009-07-16
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Publication No.: US08278408B2Publication Date: 2012-10-02
- Inventor: Yoshitsugu Goto , Shigeo Hiyama , Takuya Okada , Jun Watanabe
- Applicant: Yoshitsugu Goto , Shigeo Hiyama , Takuya Okada , Jun Watanabe
- Applicant Address: JP Tokyo
- Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Hoffmann & Baron, LLP
- Priority: JP2008-188357 20080722
- International Application: PCT/JP2009/062893 WO 20090716
- International Announcement: WO2010/010841 WO 20100128
- Main IPC: C08G77/12
- IPC: C08G77/12 ; C08G77/04 ; C08G77/20

Abstract:
Disclosed is a resin composition having an excellent balance between shortness of curing time and longness of pot life. The resin composition contains (A) an organopolysiloxane having an alkenyl group, (B) an organopolysiloxane having a silicon atom-bonded hydrogen atom, (C) a hydrosilylation catalyst, (D) a silane coupling agent and (E) an unsaturated dicarboxylic acid ester. The component (B) contains (B-1) an organopolysiloxane having a molecular weight of not less than 5,000 but not more than 50,000 and (B-2) an organopolysiloxane having a molecular weight of not less than 100 but not more than 5,000, and the ratio of (B-2) to (B-1) is preferably not less than 0.01% by mass but not more than 20% by mass.
Public/Granted literature
- US20110172345A1 RESIN COMPOSITION Public/Granted day:2011-07-14
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