Invention Grant
US08278415B2 Dimeric high affinity EGFR constructs and uses thereof 有权
二聚高亲和力EGFR构建体及其用途

  • Patent Title: Dimeric high affinity EGFR constructs and uses thereof
  • Patent Title (中): 二聚高亲和力EGFR构建体及其用途
  • Application No.: US12514631
    Application Date: 2007-12-20
  • Publication No.: US08278415B2
    Publication Date: 2012-10-02
  • Inventor: Wang BryanFrank ShiJuliane Mills
  • Applicant: Wang BryanFrank ShiJuliane Mills
  • Applicant Address: US PA Malvern
  • Assignee: Centocor, Inc.
  • Current Assignee: Centocor, Inc.
  • Current Assignee Address: US PA Malvern
  • Agent Kenneth J. Dow
  • International Application: PCT/US2007/088376 WO 20071220
  • International Announcement: WO2008/079976 WO 20080703
  • Main IPC: C07K14/00
  • IPC: C07K14/00
Dimeric high affinity EGFR constructs and uses thereof
Abstract:
Polypeptides comprising EGFR extracellular domains I-III capable of forming dimeric EGF-binding proteins are provided. The dimeric construct of the invention is useful in applications where high affinity EGF binding is desired and can be used to select agents capable of binding to native EGFR in the presence of EGF.
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