Invention Grant
US08278448B2 Technetium and rhenium complexes 失效
锝和铼络合物

  • Patent Title: Technetium and rhenium complexes
  • Patent Title (中): 锝和铼络合物
  • Application No.: US13232255
    Application Date: 2011-09-14
  • Publication No.: US08278448B2
    Publication Date: 2012-10-02
  • Inventor: Rajiv Bhalla
  • Applicant: Rajiv Bhalla
  • Applicant Address: GB Buckinghamshire
  • Assignee: GE Healthcare Limited
  • Current Assignee: GE Healthcare Limited
  • Current Assignee Address: GB Buckinghamshire
  • Priority: GB0421987.9 20041004
  • Main IPC: C07F13/00
  • IPC: C07F13/00
Technetium and rhenium complexes
Abstract:
Novel radioactive technetium and rhenium complexes comprising tripodal ligands are provided by the present invention. In particular, Tc(I) complexes are provided by the present invention. Novel ligands suitable for the formation of the technetium and rhenium complexes of the invention are also provided, as well as radiopharmaceutical compositions comprising said complexes, kits for their preparation. The invention also relates to the use of 99mTc radiopharmaceuticals of the invention for SPECT imaging.
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