Invention Grant
- Patent Title: Harness module device
- Patent Title (中): 线束模块装置
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Application No.: US12310534Application Date: 2007-09-25
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Publication No.: US08278553B2Publication Date: 2012-10-02
- Inventor: Hitoshi Suzuki , Fumihiro Okazaki , Takeshi Anzai , Kazuhiko Horikoshi , Takeshi Ogasawara
- Applicant: Hitoshi Suzuki , Fumihiro Okazaki , Takeshi Anzai , Kazuhiko Horikoshi , Takeshi Ogasawara
- Applicant Address: JP Saitama
- Assignee: Calsonic Kansei Corporation
- Current Assignee: Calsonic Kansei Corporation
- Current Assignee Address: JP Saitama
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-258375 20060925; JP2007-024864 20070202; JP2007-136810 20070523
- International Application: PCT/JP2007/068557 WO 20070925
- International Announcement: WO2008/038631 WO 20080403
- Main IPC: H01B7/00
- IPC: H01B7/00 ; H02G3/04 ; H05K5/02 ; H05K1/00 ; H05K7/14 ; H05K7/18 ; H05K9/00 ; H02B1/00 ; H01R12/00
Abstract:
A harness module structure includes a module mounting portion, which is formed upon an obverse surface of a steering support member, which extends in approximately the direction of the width of a vehicle. A harness module is installed upon the module mounting portion. The harness module includes a harness module body proper, and a module cover, which is mounted upon the harness module body proper. The harness module body proper is enclosed by the module cover and the module mounting portion, and the module cover includes a grounding portion with respect to the module mounting portion, such that the harness module body proper has an interstice with respect to the module mounting portion, and is supported in a non-contact state thereupon, by way of the grounding portion.
Public/Granted literature
- US20100186983A1 Harness module device Public/Granted day:2010-07-29
Information query
