Invention Grant
- Patent Title: Printed circuit board and method of producing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12312918Application Date: 2007-09-14
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Publication No.: US08278558B2Publication Date: 2012-10-02
- Inventor: Masashi Murakami , Kazuhito Funae
- Applicant: Masashi Murakami , Kazuhito Funae
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-346229 20061222
- International Application: PCT/JP2007/067964 WO 20070914
- International Announcement: WO2008/078435 WO 20080703
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/10
Abstract:
The portion of a board corresponding to the surrounding portion of a hole 4 formed through the board is arranged to include a patternless section 6 where a conductive film 5 is not provided.
Public/Granted literature
- US20100051321A1 PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME Public/Granted day:2010-03-04
Information query
