Invention Grant
US08278590B2 Apparatus for minimizing a heat affected zone during laser micro-machining
有权
用于在激光微加工期间最小化热影响区的装置
- Patent Title: Apparatus for minimizing a heat affected zone during laser micro-machining
- Patent Title (中): 用于在激光微加工期间最小化热影响区的装置
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Application No.: US11140341Application Date: 2005-05-27
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Publication No.: US08278590B2Publication Date: 2012-10-02
- Inventor: Brian Hall , David S. Holbrook , David L. Wall
- Applicant: Brian Hall , David S. Holbrook , David L. Wall
- Applicant Address: US NH Nashua
- Assignee: Resonetics, LLC
- Current Assignee: Resonetics, LLC
- Current Assignee Address: US NH Nashua
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/06
Abstract:
Embodiments of the present invention are directed to methods and systems for laser micro-machining, which may include dividing a long line illumination field into a plurality of individual fields, wherein each of the plurality of fields includes an aspect ratio of about 4:1 or greater, directing the plurality of individual fields onto at least one mask, wherein each individual field illuminates a corresponding area on the mask and translating the mask and/or workpiece relative to one another along a scan axis.
Public/Granted literature
- US20060266742A1 Apparatus for minimizing a heat affected zone during laser micro-machining Public/Granted day:2006-11-30
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