A method and device for soldering plural electrical connections, in which contact elements have to be soldered to soldered-connection faces positioned on a non-metallic glazing. In the method a soldering tool is used to emit a magnetic field towards the solder spots to heat these by induction. The magnitude and shape of the soldering tool is sized according to the surface area over which plural solder spots that have to be heated simultaneously in a soldering operation are situated. At the same time, the frequency of an AC voltage applied to the loop or to the coil is tailored to the connection geometry and set to 150 kHz at most. Thus, for a high work rate, markedly better heating of the components that need to be soldered is obtained because the low-frequency field lines have a greater depth of penetration into the bodies.