Invention Grant
- Patent Title: Micromechanical structure and a method of fabricating a micromechanical structure
- Patent Title (中): 微机械结构和微机械结构的制造方法
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Application No.: US12514304Application Date: 2007-11-09
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Publication No.: US08278725B2Publication Date: 2012-10-02
- Inventor: Sudhiranjan Tripathy , Vicknesh s/o Sahmuganathan
- Applicant: Sudhiranjan Tripathy , Vicknesh s/o Sahmuganathan
- Applicant Address: SG Connexis
- Assignee: Agency for Science, Technology and Research
- Current Assignee: Agency for Science, Technology and Research
- Current Assignee Address: SG Connexis
- Agency: Morrision & Foerster LLP
- International Application: PCT/SG2007/000386 WO 20071109
- International Announcement: WO2008/057055 WO 20080515
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/04
Abstract:
A micromechanical structure and a method of fabricating a micromechanical structure are provided. The micromechanical structure comprises a silicon (Si) based substrate; a micromechanical element formed directly on the substrate; and an undercut formed underneath a released portion of the micromechanical element; wherein the undercut is in the form of a recess formed in the Si based substrate.
Public/Granted literature
- US20100193781A1 MICROMECHANICAL STRUCTURE AND A METHOD OF FABRICATING A MICROMECHANICAL STRUCTURE Public/Granted day:2010-08-05
Information query
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