Invention Grant
US08278733B2 Bonding pad structure and integrated circuit chip using such bonding pad structure
有权
使用这种焊盘结构的焊盘结构和集成电路芯片
- Patent Title: Bonding pad structure and integrated circuit chip using such bonding pad structure
- Patent Title (中): 使用这种焊盘结构的焊盘结构和集成电路芯片
-
Application No.: US12729224Application Date: 2010-03-22
-
Publication No.: US08278733B2Publication Date: 2012-10-02
- Inventor: Ming-Tzong Yang , Yu-Hua Huang
- Applicant: Ming-Tzong Yang , Yu-Hua Huang
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: Mediatek Inc.
- Current Assignee: Mediatek Inc.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/485
Abstract:
An integrated circuit chip includes a substrate; a topmost metal layer over the substrate; a lower metal layer on or over the substrate and lower than the topmost metal layer; and at least one bonding pad in the lower metal layer.
Public/Granted literature
- US20110049671A1 BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP USING SUCH BONDING PAD STRUCTURE Public/Granted day:2011-03-03
Information query
IPC分类:
