Invention Grant
- Patent Title: Method for manufacturing semiconductor device, semiconductor device, and electronic appliance
- Patent Title (中): 半导体器件,半导体器件和电子器件的制造方法
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Application No.: US13078478Application Date: 2011-04-01
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Publication No.: US08278740B2Publication Date: 2012-10-02
- Inventor: Satoshi Toriumi , Noriyoshi Suzuki
- Applicant: Satoshi Toriumi , Noriyoshi Suzuki
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2007-271683 20071018
- Main IPC: H01L23/58
- IPC: H01L23/58

Abstract:
An object of the present invention is to provide a semiconductor device including an insulating layer with a high dielectric strength voltage, a low dielectric constant, and low hygroscopicity. Another object of the present invention is to provide an electronic appliance with high performance and high reliability, which uses the semiconductor device. An insulator containing nitrogen, such as silicon oxynitride or silicon nitride oxide, and an insulator containing nitrogen and fluorine, such as silicon oxynitride added with fluorine or silicon nitride oxide added with fluorine, are alternately deposited so that an insulating layer is formed. By sandwiching an insulator containing nitrogen and fluorine between insulators containing nitrogen, the insulator containing nitrogen and fluorine can be prevented from absorbing moisture and thus a dielectric strength voltage can be increased. Further, an insulator contains fluorine so that a dielectric constant can be reduced.
Public/Granted literature
- US20110175208A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPLIANCE Public/Granted day:2011-07-21
Information query
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