Invention Grant
- Patent Title: Heat conduction board and mounting method of electronic components
- Patent Title (中): 导热板和电子元器件的安装方法
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Application No.: US12820611Application Date: 2010-06-22
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Publication No.: US08278750B2Publication Date: 2012-10-02
- Inventor: Hideki Akahori
- Applicant: Hideki Akahori
- Applicant Address: JP Shizuoka
- Assignee: NEC Access Technica, Ltd
- Current Assignee: NEC Access Technica, Ltd
- Current Assignee Address: JP Shizuoka
- Priority: JP2009-263897 20091119
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34
Abstract:
A heat conduction board, include a heat dissipation member; a heat conduction member which is arranged on the heat dissipation member and conducts a heat thereto; a lead frame which is formed in a wire pattern shape, and is arranged on the heat conduction member; and a printed circuit board which mounts a second electronic component for controlling a first electronic component; wherein the first electronic component and the printed circuit board are soldered to the lead frame.
Public/Granted literature
- US20110116236A1 HEAT CONDUCTION BOARD AND MOUNTING METHOD OF ELECTRONIC COMPONENTS Public/Granted day:2011-05-19
Information query
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