Invention Grant
- Patent Title: Apparatus and method for monitoring current flow to integrated circuit in temperature-compensated manner
- Patent Title (中): 以温度补偿方式监测集成电路的电流流动的装置和方法
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Application No.: US12716787Application Date: 2010-03-03
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Publication No.: US08278950B2Publication Date: 2012-10-02
- Inventor: Shahin Solki
- Applicant: Shahin Solki
- Applicant Address: CA Markham, Ontario
- Assignee: ATI Technologies ULC
- Current Assignee: ATI Technologies ULC
- Current Assignee Address: CA Markham, Ontario
- Agency: Faegre Baker Daniels LLP
- Main IPC: G01R27/08
- IPC: G01R27/08 ; G01R31/02

Abstract:
A circuit and method for monitoring current flow to an integrated circuit (IC), alone or mounted on a substrate, in a temperature-compensated manner. In accordance with a preferred embodiment, a plurality of resistances having substantially equal temperature coefficients establishes a ratio of an output voltage and an internally measured voltage, with the output voltage corresponding to a voltage drop across an inherent resistance within the IC or on the substrate.
Public/Granted literature
- US20110215823A1 APPARATUS AND METHOD FOR MONITORING CURRENT FLOW TO INTEGRATED CIRCUIT IN TEMPERATURE-COMPENSATED MANNER Public/Granted day:2011-09-08
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