Invention Grant
- Patent Title: Test interconnect
- Patent Title (中): 测试互连
-
Application No.: US12054281Application Date: 2008-03-24
-
Publication No.: US08278955B2Publication Date: 2012-10-02
- Inventor: Illavarasan M. Palaniappa , Kanapathipillai Prabakaran
- Applicant: Illavarasan M. Palaniappa , Kanapathipillai Prabakaran
- Applicant Address: US KS Kansas City
- Assignee: Interconnect Devices, Inc.
- Current Assignee: Interconnect Devices, Inc.
- Current Assignee Address: US KS Kansas City
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Main IPC: G01R1/067
- IPC: G01R1/067 ; G01R31/00
Abstract:
According to an example embodiment, a contact cell includes a first element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the first element. The contact cell further includes a second element that is flexible and electrically conductive, and that is structured to have at least one bend along an entire length of the second element. The contact cell further includes a tie that is electrically non-conductive, and that is affixed to the first element and affixed to the second element such that the first element and second element are physically and electrically separated from each other.
Public/Granted literature
- US20090237097A1 TEST INTERCONNECT Public/Granted day:2009-09-24
Information query
