Invention Grant
- Patent Title: Resistive touch panel
- Patent Title (中): 电阻式触摸屏
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Application No.: US12588196Application Date: 2009-10-07
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Publication No.: US08279198B2Publication Date: 2012-10-02
- Inventor: Lung-Sheng Hsih
- Applicant: Lung-Sheng Hsih
- Applicant Address: TW Taipei
- Assignee: Minlead Ltd.
- Current Assignee: Minlead Ltd.
- Current Assignee Address: TW Taipei
- Agency: Bacon & Thomas, PLLC
- Priority: TW98207595U 20090505
- Main IPC: G09G5/00
- IPC: G09G5/00

Abstract:
A resistive touch panel has a lower panel module and an upper panel module, an adhesive layer, a separating layer and a flexible circuit board. The lower panel module has a substrate, a lower conducting layer and a plurality of electrodes. The upper panel module has a protective film, an upper conducting layer, a pattern layer, an ink electrode mounted to electrically connect with the flexible circuit board, and an insulation layer. One end of the flexible circuit board and the separating layer are sandwiched between the top surface of the lower conducting layer and the top surface of the upper conducting layer. Given the foregoing structure, the components and steps for fabricating the resistive touch panel can be reduced since the pattern layer is directly printed on the bottom surface of the upper conducting layer. Therefore, fabricating yields are increased.
Public/Granted literature
- US20100283755A1 Resistive touch panel Public/Granted day:2010-11-11
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