A thermal head includes heat generating parts and a conductive layer having connecting parts electrically connected to ends of the heat generating parts. The conductive layer has wiring parts whose cross-sectional areas are smaller than cross-sectional areas of the respective connecting parts in directions. The wiring parts has a first upper layer and a second upper layer which have smaller widths in arrow directions than widths of the respective connecting parts as well as a first lower layer and a second lower layer which have lengths not shorter than the widths of the respective connecting parts and greater than the widths of the respective upper layers. The respective upper layers and the respective lower layers are arranged to overlap each other.