When a transition is performed from a state where one wafer stage is positioned in an area including a liquid immersion area to a state where the other wafer stage is positioned in the area including the liquid immersion area, eaves sections arranged in both wafer stages are to be engaged to make a proximity or a contact state in the X-axis direction, and both stages are simultaneously driven in the X-axis direction while maintaining the state. In this manner, the liquid immersion area moves back and forth between the two stages via the eaves sections. This can restrain leakage of the liquid via a gap between both wafer stages, and further, a liquid leakage to the reflection surfaces arranged on the side surface of both wafer stages can be restrained. Further, interference between the reflection surfaces arranged in both wafer stages can be avoided.