Invention Grant
- Patent Title: Method for measuring thickness
- Patent Title (中): 厚度测量方法
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Application No.: US12746548Application Date: 2008-04-01
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Publication No.: US08279447B2Publication Date: 2012-10-02
- Inventor: Heui-Jae Pahk , Young-Min Hwang , Woo-Jung Ahn
- Applicant: Heui-Jae Pahk , Young-Min Hwang , Woo-Jung Ahn
- Applicant Address: KR Seoul
- Assignee: Snu Precision Co., Ltd.
- Current Assignee: Snu Precision Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dority & Manning, P.A.
- Priority: KR10-2008-0010300 20080131
- International Application: PCT/KR2008/001833 WO 20080401
- International Announcement: WO2009/096633 WO 20090806
- Main IPC: G01B11/02
- IPC: G01B11/02

Abstract:
Disclosed is a method for measuring a thickness of a subjecting layer attached on a base layer by means of an interferometer, which includes the steps of: obtaining a correlation equation of a phase difference with respect to thicknesses of sample layers, the thicknesses being different from each other, the sample layers being made from a material substantially equal to a material of the subjecting layer; obtaining a first interference signal with respect to an optical axial direction incident to the base layer at a boundary surface between an air layer and the base layer; obtaining a second interference signal with respect to the optical axial direction at a boundary surface between the subjecting layer and the base layer; obtaining a phase difference between a phase of the first interference signal and a phase of the second interference signal at respective heights substantially equal to each other with respect to the optical axial direction; and determining a thickness of the subjecting layer by inserting the phase difference into the correlation equation.
Public/Granted literature
- US20100277745A1 Method for Measuring Thickness Public/Granted day:2010-11-04
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