Invention Grant
- Patent Title: Top bond pad bias and variation control
- Patent Title (中): 顶部粘结垫偏差和变化控制
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Application No.: US13289752Application Date: 2011-11-04
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Publication No.: US08279558B2Publication Date: 2012-10-02
- Inventor: Joel David Limmer , Bradley Jay Ver Meer
- Applicant: Joel David Limmer , Bradley Jay Ver Meer
- Applicant Address: US CA Scotts Valley
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Scotts Valley
- Agency: Fredrikson & Byron, P.A.
- Main IPC: G11B5/60
- IPC: G11B5/60 ; G11B21/21

Abstract:
An assembly includes a slider and a suspension assembly. The slider includes an air bearing surface and a slider mounting surface opposite the air bearing surface. There are a plurality of slider pads on the slider mounting surface. The suspension assembly includes a plurality of suspension pads on a suspension mounting surface. Each of the suspension pads is connected to one of the slider pads with a solder joint so that the slider mounting surface has at least one of a pitch, roll, or yaw angle with respect to the suspension mounting.
Public/Granted literature
- US20120050917A1 TOP BOND PAD BIAS AND VARIATION CONTROL Public/Granted day:2012-03-01
Information query
IPC分类: