Invention Grant
US08279560B1 Head stack assembly with suspension tail bond alignment by solder pin
有权
头部堆叠组件，具有通过焊接销的悬挂尾端对准
- Patent Title: Head stack assembly with suspension tail bond alignment by solder pin
- Patent Title (中): 头部堆叠组件，具有通过焊接销的悬挂尾端对准
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Application No.: US12397878Application Date: 2009-03-04
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Publication No.: US08279560B1Publication Date: 2012-10-02
- Inventor: Tzong-Shii Pan
- Applicant: Tzong-Shii Pan
- Applicant Address: US CA Irvine
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A flexure tail of a head gimbal assembly (HGA) is aligned with a flex cable of a head stack assembly (HSA). At least one solder ball is adhered to a bond pad on the flex cable. The solder ball is entered into a first alignment hole in the flexure tail while the solder ball is solid.
Information query
IPC分类:
