A thermally protected surge suppression device comprises a housing and a base seat with a mounting plate. The base seat is provided with a surge suppression component and a thermal protection device, and the thermal protection device further comprises a metal bulge electrically connecting to the electrode B of the surge suppression component, a compression spring, a slider provided with an arc extinguishing component movable on the guide-track groove. In normal working condition, the conductive metal member electrically connects to the metal bulge via a low temperature solder. When the surge suppression component fails, the low temperature solder is melt owing to being passed through the power frequency fault current, the conductive metal member is disconnected from the metal bulge, the compression spring pushes the arc extinguishing component to move to obstruct the disconnected gap, and form an airflow to extinguish the electric arc between the conductive metal member and the metal bulge. The present invention provides a safer, more timely and reliable circuit protection.