Invention Grant
US08279601B2 Air flow ducts for cooling electronic devices within a data processing unit
有权
用于在数据处理单元内冷却电子设备的气流管道
- Patent Title: Air flow ducts for cooling electronic devices within a data processing unit
- Patent Title (中): 用于在数据处理单元内冷却电子设备的气流管道
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Application No.: US12695509Application Date: 2010-01-28
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Publication No.: US08279601B2Publication Date: 2012-10-02
- Inventor: David J. Lima , John Kull
- Applicant: David J. Lima , John Kull
- Applicant Address: US CA Sunnyvale
- Assignee: Juniper Networks, Inc.
- Current Assignee: Juniper Networks, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Cooley LLP
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Air flow ducts for improving the air flow within data processing units are described herein. In some embodiments, a duct includes an inlet portion and an outlet portion. An interior surface of the outlet portion of the duct defines, at least in part, a portion of a flow path. The duct is configured to be coupled to a printed circuit board within a data processing unit such that a first portion of a cooling fluid can flow within the flow path between the inlet portion of the duct and an electronic device coupled to the printed circuit board. An exterior surface of the outlet portion of the duct is configured to redirect a second portion of the cooling fluid to a volume within the data processing unit apart from the electronic device.
Public/Granted literature
- US20110182027A1 AIR FLOW DUCTS FOR COOLING ELECTRONIC DEVICES WITHIN A DATA PROCESSING UNIT Public/Granted day:2011-07-28
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