Invention Grant
- Patent Title: Heatsink device directly contacting a heat source to achieve a quick dissipation effect
- Patent Title (中): 散热装置直接接触热源实现快速消散效果
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Application No.: US12871987Application Date: 2010-08-31
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Publication No.: US08279608B2Publication Date: 2012-10-02
- Inventor: Chuan-Fu Chen
- Applicant: Chuan-Fu Chen
- Agency: Kamrath IP Lawfirm, PA
- Agent Alan Kamrath
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heatsink device includes an insulating board having at least one periphery, a first face and a second face, at least two conductive plates mounted on at least one of the first face and the second face of the insulating board, and at least one heat source mounted on the insulating board and having two conducting poles conducted with the at least two conductive plates. Thus, the at least two conductive plates are directly connected with the two conducting poles of the at least one heat source so that the at least two conductive plates can carry away the heat produced by the at least one heat source so as to provide a heatsink effect to the at least one heat source.
Public/Granted literature
- US20120050997A1 Heatsink Device Directly Contacting a Heat Source to Achieve a Quick Dissipation Effect Public/Granted day:2012-03-01
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