Invention Grant
- Patent Title: Core modem assembly for mobile communication device
- Patent Title (中): 用于移动通信设备的核心调制解调器组件
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Application No.: US12542225Application Date: 2009-08-17
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Publication No.: US08280318B2Publication Date: 2012-10-02
- Inventor: Randolph Cary Demuynck , David Ryan Story
- Applicant: Randolph Cary Demuynck , David Ryan Story
- Applicant Address: SE Lund
- Assignee: Sony Mobile Communications AB
- Current Assignee: Sony Mobile Communications AB
- Current Assignee Address: SE Lund
- Agency: Coats & Bennett, P.L.L.C.
- Main IPC: H04B1/38
- IPC: H04B1/38

Abstract:
The invention described herein provides a core modem assembly for a communication circuit that is well suited for mobile communication devices such as cellular phones, personal digital assistants, laptop computers, and hand-held computers. The core modem assembly comprises a baseband module, an RF module, and a socket connector that provides electrical isolation between the baseband module and RF module. The core modem assembly achieves a very small form factor and provides shielding between the baseband module and RF module. Further, the core modem assembly uses a “plug and play” design allowing late customization and interchangeability of the modules.
Public/Granted literature
- US20110038401A1 Core Modem Assembly for Mobile Communication Device Public/Granted day:2011-02-17
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