Invention Grant
- Patent Title: Board or electronic component warp analyzing method, board or electronic component warp analyzing system and board or electronic component warp analyzing program
- Patent Title (中): 板或电子元件翘曲分析方法，板或电子元件翘曲分析系统和板或电子元件翘曲分析程序
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Application No.: US12306491Application Date: 2007-06-25
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Publication No.: US08280649B2Publication Date: 2012-10-02
- Inventor: Ichiro Hirata
- Applicant: Ichiro Hirata
- Applicant Address: JP Tokyo
- Assignee: NEC Corporation
- Current Assignee: NEC Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2006-176389 20060627
- International Application: PCT/JP2007/063188 WO 20070625
- International Announcement: WO2008/001922 WO 20080103
- Main IPC: G01L1/00
- IPC: G01L1/00 ; G01K5/00
Abstract:
Board warp analysis includes dividing a temperature profile with respect to an electronic component by a predetermined time. A relaxation elastic modulus of the electronic component corresponding to the divisional time is obtained by shifting on a time base of a master curve related to the electronic component A curing degree of the electronic component is calculated based on a relationship between a time after shift and an actually applied temperature. A warp of the electronic component is analyzed based on a relaxation elastic modulus on the master curve or a relaxation elastic modulus calculated based on a relationship between the curing degree and the elastic constant according to a value of the curing degree calculated.
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