Invention Grant
- Patent Title: Scan path switch testing of output buffer with ESD
- Patent Title (中): 输出缓冲器的ESD扫描路径开关测试
-
Application No.: US13352484Application Date: 2012-01-18
-
Publication No.: US08281194B2Publication Date: 2012-10-02
- Inventor: Lee D. Whetsel
- Applicant: Lee D. Whetsel
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; W. James Brady; Frederick J. Telecky, Jr.
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
The peripheral circuitry (350, 360, ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.
Public/Granted literature
- US20120117434A1 PROBELESS TESTING OF PAD BUFFERS ON WAFER Public/Granted day:2012-05-10
Information query