Invention Grant
- Patent Title: Hybrid self-test circuit structure
- Patent Title (中): 混合自检电路结构
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Application No.: US12772407Application Date: 2010-05-03
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Publication No.: US08281199B2Publication Date: 2012-10-02
- Inventor: Yu-Tsao Hsing , Li-Ming Teng
- Applicant: Yu-Tsao Hsing , Li-Ming Teng
- Applicant Address: TW Hsinchu
- Assignee: Hoy Technologies, Co., Ltd.
- Current Assignee: Hoy Technologies, Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Bacon & Thomas, PLLC
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G01R31/28 ; G01R31/3187

Abstract:
A hybrid self-test circuit structure comprises a plurality of input terminals and a plurality of output terminals for testing a plurality of memory units. The circuit structure comprises a first level functional unit for driving a plurality of first output terminals electrically coupled to the first level functional unit to output an output signal according to an external control signal transmitted from the outside; a plurality of second level functional units for receiving the output signal and generating a test signal according to the output signal and outputting the test signal to the memory units; a parallel interface parallelly installed between the first level functional unit and at least one of the second level functional units; and a serial interface serially installed between the first level functional unit and at least one of the second level functional units.
Public/Granted literature
- US20110267071A1 HYBRID SELF-TEST CIRCUIT STRUCTURE Public/Granted day:2011-11-03
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