Invention Grant
- Patent Title: Methods of building modular clipping packaging apparatus
- Patent Title (中): 建立模块化剪裁包装设备的方法
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Application No.: US13102468Application Date: 2011-05-06
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Publication No.: US08281556B2Publication Date: 2012-10-09
- Inventor: Samuel D. Griggs , Dennis J. May , David T. Wince , William M. Poteat , Derek L. Brown
- Applicant: Samuel D. Griggs , Dennis J. May , David T. Wince , William M. Poteat , Derek L. Brown
- Applicant Address: US NC Apex
- Assignee: Tipper Tie, Inc.
- Current Assignee: Tipper Tie, Inc.
- Current Assignee Address: US NC Apex
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: B65B61/00
- IPC: B65B61/00 ; B65B47/00

Abstract:
Packaging apparatus modules include a frame with a base adapted to reside on a support floor, the frame having opposing right and left hand frame sides and at least one lateral beam that extends therebetween, the right and left hand frame sides comprising respective upwardly extending frame portions which are configured to reside on opposing sides of a longitudinal product travel path having an axially extending centerline; and a clipper mechanism configured to selectively attach to either one of the right and left hand frame sides in a manner that positions the clipper mechanism at a substantially common operative full-clip location in the product travel path when mounted to either the right or left hand frame sides to thereby allow build options with selectable mounting orientations.
Public/Granted literature
- US20110209331A1 METHODS OF BUILDING MODULAR CLIPPING PACKAGING APPARATUS Public/Granted day:2011-09-01
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