Invention Grant
US08281838B2 Work bonding and supporting method and work bonding and supporting apparatus using the same
失效
工作粘合和支撑方法以及使用其的工作粘合和支撑装置
- Patent Title: Work bonding and supporting method and work bonding and supporting apparatus using the same
- Patent Title (中): 工作粘合和支撑方法以及使用其的工作粘合和支撑装置
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Application No.: US13339657Application Date: 2011-12-29
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Publication No.: US08281838B2Publication Date: 2012-10-09
- Inventor: Yasuji Kaneshima , Masayuki Yamamoto
- Applicant: Yasuji Kaneshima , Masayuki Yamamoto
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2006-032637 20060209
- Main IPC: B32B37/00
- IPC: B32B37/00
Abstract:
Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.
Public/Granted literature
- US20120097338A1 WORK BONDING AND SUPPORTING METHOD AND WORK BONDING AND SUPPORTING APPARATUS USING THE SAME Public/Granted day:2012-04-26
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