Invention Grant
- Patent Title: Dispensing apparatus
- Patent Title (中): 点胶装置
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Application No.: US12700911Application Date: 2010-02-05
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Publication No.: US08281963B2Publication Date: 2012-10-09
- Inventor: Da-Wei Liu
- Applicant: Da-Wei Liu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910308833 20091026
- Main IPC: B65D47/00
- IPC: B65D47/00

Abstract:
A dispensing apparatus includes a mounting plate and a dispenser fixed to the mounting plate. The dispenser includes a nozzle valve, a valve plug, an actuating shaft, and a nozzle. The nozzle valve defines a cavity containing a material, and defines an inlet opening on a sidewall thereof to communicate with the cavity. The valve plug is disposed in the cavity. The actuating shaft extends through an end of the nozzle valve, and is connected to the valve plug. The nozzle is disposed at the other end of the nozzle valve facing the actuating shaft. The actuating shaft moves the valve plug away from or closer to the nozzle so as to close or open the inlet opening.
Public/Granted literature
- US20110095056A1 DISPENSING APPARATUS Public/Granted day:2011-04-28
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