Invention Grant
- Patent Title: Printhead assembly with cappedprinthead modules
- Patent Title (中): 带盖帽组件的打印头组件
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Application No.: US12236499Application Date: 2008-09-24
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Publication No.: US08282190B2Publication Date: 2012-10-09
- Inventor: Kia Silverbrook , Tobin Allen King
- Applicant: Kia Silverbrook , Tobin Allen King
- Applicant Address: IE Dublin
- Assignee: Zamtec Limited
- Current Assignee: Zamtec Limited
- Current Assignee Address: IE Dublin
- Priority: AUPR3995 20010327
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A printhead assembly includes an elongate carrier. A plurality of printhead modules is serially positioned on the carrier. Each printhead module includes an ink supply arrangement mounted on the carrier and a printhead chip mounted on the ink supply arrangement to be fed with ink from the ink supply arrangement. A plurality of capping devices is mounted on the carrier. Each capping device is displaceable with respect to the carrier between an operative position in which the capping device caps the printhead chip and an inoperative position in which the printhead chip is uncapped.
Public/Granted literature
- US20090015629A1 PRINTHEAD ASSEMBLY WITH CAPPEDPRINTHEAD MODULES Public/Granted day:2009-01-15
Information query
IPC分类: