A reinforcing plate fixed to a connector main body is arranged on a bottom surface of the connector main body to come into surface contact with a surface of a substrate while a plurality of holes is provided on a surface, which contacts the substrate, of the reinforcing plate. When the reinforcing plate is soldered to the substrate, therefore, a solder wraps around not only a peripheral edge of the reinforcing plate but also an edge of each of the holes so that a soldering portion between the reinforcing plate and the substrate can be sufficiently ensured.