Invention Grant
- Patent Title: Organometallic complex and method for producing the same
- Patent Title (中): 有机金属络合物及其制造方法
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Application No.: US12879068Application Date: 2010-09-10
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Publication No.: US08283468B2Publication Date: 2012-10-09
- Inventor: Hiroshi Sakai , Izuru Kanoya , Terumi Furuta , Mitsuya Hosoe
- Applicant: Hiroshi Sakai , Izuru Kanoya , Terumi Furuta , Mitsuya Hosoe
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Capitol City TechLaw, PLLC
- Priority: JP2009-213416 20090915
- Main IPC: C07D213/80
- IPC: C07D213/80 ; C07F1/08

Abstract:
An organometallic complex [Cu2(pyridine-3,5-dicarboxylate)2]n is provided by bonding a plurality of Cu2(pyridine-3,5-dicarboxylate)2 repeating units to each other. The organometallic complex can be obtained by the steps of dissolving copper acetate monohydrate or anhydrate and pyridine-3,5-dicarboxylic acid in a solvent, heating the solution at 50° C. to 140° C. for 24 to 168 hours to generate a reaction product, and then removing a guest molecule from the reaction product.
Public/Granted literature
- US20110065921A1 Organometallic Complex and Method for Producing the Same Public/Granted day:2011-03-17
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