Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12868686Application Date: 2010-08-25
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Publication No.: US08283572B2Publication Date: 2012-10-09
- Inventor: Guang-Feng Ou , Yong-Zhao Huang
- Applicant: Guang-Feng Ou , Yong-Zhao Huang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010231585 20100720
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A printed circuit board includes a reference layer configured to connect to a power or a ground and a dielectric layer stacked on the reference layer. The dielectric layer includes a component surface opposing the reference layer. The component surface forms a differential pairs, a protection runner, and a power runner. The differential pairs include a substantially linear part. The protection runner is intervened between the linear part and the power runner, and is substantially parallel to the differential pairs. The length of the protection runner is approximately equal to that of the linear part. Each of the two ends of the protection runner forms a via that electrically connects the protection runner to the reference layer.
Public/Granted literature
- US20120018210A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-01-26
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