Invention Grant
- Patent Title: Disguising test pads in a semiconductor package
- Patent Title (中): 伪装半导体封装中的测试焊盘
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Application No.: US13041895Application Date: 2011-03-07
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Publication No.: US08283664B2Publication Date: 2012-10-09
- Inventor: Arie Frenklakh
- Applicant: Arie Frenklakh
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus & DeNiro LLP
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L29/10
Abstract:
A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads.
Public/Granted literature
- US20110156035A1 DISGUISING TEST PADS IN A SEMICONDUCTOR PACKAGE Public/Granted day:2011-06-30
Information query
IPC分类:
