Invention Grant
- Patent Title: Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride
- Patent Title (中): 制造氮化镓或镓和氮化铝层的方法
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Application No.: US13313522Application Date: 2011-12-07
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Publication No.: US08283673B2Publication Date: 2012-10-09
- Inventor: Hacene Lahreche
- Applicant: Hacene Lahreche
- Applicant Address: FR Bernin
- Assignee: Soitec
- Current Assignee: Soitec
- Current Assignee Address: FR Bernin
- Agency: Winston & Strawn LLP
- Priority: FR0851891 20080325
- Main IPC: H01L29/15
- IPC: H01L29/15

Abstract:
The present invention relates to a crack-free monocrystalline nitride layer having the composition AlxGa1−xN, where 0≦x≦0.3, and a substrate that is likely to generate tensile stress in the nitride layer. The structure successively includes the substrate; a nucleation layer; a monocrystalline intermediate layer having a selected thickness on the nucleation layer; a monocrystalline seed layer of an AlBN compound in which the boron content is between 0 and 10% having a selected thickness on the intermediate layer and a relaxation rate, at ambient temperature, of less than 80%; and the monocrystalline nitride layer.
Public/Granted literature
- US20120074427A1 METHOD FOR MANUFACTURING A LAYER OF GALLIUM NITRIDE OR GALLIUM AND ALUMINUM NITRIDE Public/Granted day:2012-03-29
Information query
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