Invention Grant
US08283673B2 Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride 有权
制造氮化镓或镓和氮化铝层的方法

  • Patent Title: Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride
  • Patent Title (中): 制造氮化镓或镓和氮化铝层的方法
  • Application No.: US13313522
    Application Date: 2011-12-07
  • Publication No.: US08283673B2
    Publication Date: 2012-10-09
  • Inventor: Hacene Lahreche
  • Applicant: Hacene Lahreche
  • Applicant Address: FR Bernin
  • Assignee: Soitec
  • Current Assignee: Soitec
  • Current Assignee Address: FR Bernin
  • Agency: Winston & Strawn LLP
  • Priority: FR0851891 20080325
  • Main IPC: H01L29/15
  • IPC: H01L29/15
Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride
Abstract:
The present invention relates to a crack-free monocrystalline nitride layer having the composition AlxGa1−xN, where 0≦x≦0.3, and a substrate that is likely to generate tensile stress in the nitride layer. The structure successively includes the substrate; a nucleation layer; a monocrystalline intermediate layer having a selected thickness on the nucleation layer; a monocrystalline seed layer of an AlBN compound in which the boron content is between 0 and 10% having a selected thickness on the intermediate layer and a relaxation rate, at ambient temperature, of less than 80%; and the monocrystalline nitride layer.
Information query
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/02 .按其半导体本体的特征区分的
H01L29/12 ..按其构成材料的特征区分的
H01L29/15 ... · ·带有周期性或准周期性电势变化的结构,如多量子阱、超晶格(应用于光控制的这种结构入G02F1/017;应用于半导体激光器的入H01S5/34)
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