Invention Grant
- Patent Title: Chip-bonding light emitting diode chip
- Patent Title (中): 芯片贴片发光二极管芯片
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Application No.: US12629030Application Date: 2009-12-01
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Publication No.: US08283683B2Publication Date: 2012-10-09
- Inventor: Chang-Da Tsai , Wei-Che Wu , Chia-Liang Hsu , Ching-Shih Ma
- Applicant: Chang-Da Tsai , Wei-Che Wu , Chia-Liang Hsu , Ching-Shih Ma
- Applicant Address: TW Hsinchu
- Assignee: Opto Tech Corporation
- Current Assignee: Opto Tech Corporation
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Priority: TW95141205A 20061107
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region.
Public/Granted literature
- US20100072497A1 LIGHT EMITTING DIODE CHIP Public/Granted day:2010-03-25
Information query
IPC分类:
