Invention Grant
- Patent Title: Surface mounted LED package
- Patent Title (中): 表面贴装LED封装
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Application No.: US13175134Application Date: 2011-07-01
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Publication No.: US08283689B2Publication Date: 2012-10-09
- Inventor: Chih-Lung Liang , Yuan-Fu Chen
- Applicant: Chih-Lung Liang , Yuan-Fu Chen
- Applicant Address: TW Taipei
- Assignee: Lite-On Technology Corporation
- Current Assignee: Lite-On Technology Corporation
- Current Assignee Address: TW Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW98110858A 20090401
- Main IPC: H01L33/52
- IPC: H01L33/52 ; H01L33/58 ; H01L33/60
Abstract:
An LED device and LED module are provided. The LED device is coupled to a lead frame with a first plane and a second plane opposite to the first plane, the lead frame having a LED chip disposed on the first plane. The LED device includes a reflection cup structure disposed on the lead frame, a lens structure and at least one fixing structure. The LED chip is disposed in the reflection cup structure and electrically connected to the first plane of the lead frame. The lens structure covers the first plane and the second plane of the lead frame. The fixing structure and the fixing structures are formed integrally and cover the lead frame cooperatively.
Public/Granted literature
- US20110254026A1 SURFACE MOUNTED LED PACKAGE Public/Granted day:2011-10-20
Information query
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