Invention Grant
- Patent Title: Memory element and semiconductor device, and method for manufacturing the same
- Patent Title (中): 存储元件和半导体器件及其制造方法
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Application No.: US12034334Application Date: 2008-02-20
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Publication No.: US08283724B2Publication Date: 2012-10-09
- Inventor: Yoshiharu Hirakata
- Applicant: Yoshiharu Hirakata
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP2007-045558 20070226
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
It is an object to solve inhibition of miniaturization of an element and complexity of a manufacturing process thereof. It is another object to provide a nonvolatile memory device and a semiconductor device having the memory device, in which data can be additionally written at a time besides the manufacturing time and in which forgery caused by rewriting of data can be prevented. It is further another object to provide an inexpensive nonvolatile memory device and semiconductor device. A memory element is manufactured in which a first conductive layer, a second conductive layer that is beside the first conductive layer, and conductive fine particles of each surface which is covered with an organic film are deposited over an insulating film. The conductive fine particles are deposited between the first conductive layer and the second conductive layer.
Public/Granted literature
- US20080205132A1 Memory Element and Semiconductor Device, and Method for Manufacturing the Same Public/Granted day:2008-08-28
Information query
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