Invention Grant
- Patent Title: Electronic component with buffer layer
- Patent Title (中): 带缓冲层的电子部件
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Application No.: US11841294Application Date: 2007-08-20
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Publication No.: US08283756B2Publication Date: 2012-10-09
- Inventor: Ivan Galesic , Joachim Mahler , Alexander Heinrich , Khalil Hosseini
- Applicant: Ivan Galesic , Joachim Mahler , Alexander Heinrich , Khalil Hosseini
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An electronic component includes a metal substrate, a semiconductor chip configured to be attached to the metal substrate, and a buffer layer positioned between the metal substrate and the semiconductor chip configured to mechanically decouple the semiconductor chip and the metal substrate. The buffer layer extends across less than an entire bottom surface of the semiconductor chip.
Public/Granted literature
- US20090051016A1 ELECTRONIC COMPONENT WITH BUFFER LAYER Public/Granted day:2009-02-26
Information query
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