Invention Grant
- Patent Title: Lead frame having outer leads coated with a four layer plating
- Patent Title (中): 引线框架，其外部引线涂覆有四层电镀
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Application No.: US11582972Application Date: 2006-10-19
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Publication No.: US08283759B2Publication Date: 2012-10-09
- Inventor: Seishi Oida , Takahiro Nakano , Yoshito Miyahara , Takashi Yoshie , Harunobu Satou , Kouichi Kadosaki , Kazumitsu Seki
- Applicant: Seishi Oida , Takahiro Nakano , Yoshito Miyahara , Takashi Yoshie , Harunobu Satou , Kouichi Kadosaki , Kazumitsu Seki
- Applicant Address: JP Osaka JP Nagano
- Assignee: Panasonic Corporation,Shinko Electric Industries Co., Ltd.
- Current Assignee: Panasonic Corporation,Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Osaka JP Nagano
- Agency: McDermott Will & Emery LLP
- Priority: JP2005-306379 20051020
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/00
Abstract:
A lead frame base is coated with a four-layer plating. The four-layer plating includes an underlayer plating (Ni), a palladium plating, a silver plating and a gold plating arranged in this order from bottom to top.
Public/Granted literature
- US20070090501A1 Lead frame Public/Granted day:2007-04-26
Information query
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