Invention Grant
US08283761B2 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
有权
用于制造封装的微电子器件的封装的微电子器件和方法
- Patent Title: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
- Patent Title (中): 用于制造封装的微电子器件的封装的微电子器件和方法
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Application No.: US13171293Application Date: 2011-06-28
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Publication No.: US08283761B2Publication Date: 2012-10-09
- Inventor: Teck Kheng Lee , Voon Siong Chin , Ai Chie Wang
- Applicant: Teck Kheng Lee , Voon Siong Chin , Ai Chie Wang
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/44
Abstract:
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side.
Public/Granted literature
- US20110254144A1 PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES Public/Granted day:2011-10-20
Information query
IPC分类:
