Invention Grant
US08283764B2 Microelectronic assembly with an embedded waveguide adapter and method for forming the same
有权
具有嵌入式波导适配器的微电子组件及其形成方法
- Patent Title: Microelectronic assembly with an embedded waveguide adapter and method for forming the same
- Patent Title (中): 具有嵌入式波导适配器的微电子组件及其形成方法
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Application No.: US13436432Application Date: 2012-03-30
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Publication No.: US08283764B2Publication Date: 2012-10-09
- Inventor: Jinbang Tang
- Applicant: Jinbang Tang
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductors, Inc.
- Current Assignee: Freescale Semiconductors, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L23/06
- IPC: H01L23/06
Abstract:
A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate is provided. The semiconductor substrate has first and second opposing sides and first and second portions. A tuning depression is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor is formed on the first opposing side of the first semiconductor substrate. The radio frequency conductor has a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate. A microelectronic die having an integrated circuit formed therein is attached to the first opposing side and the first portion of the semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor.
Public/Granted literature
- US20120223325A1 MICROELECRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METHOD FOR FORMING THE SAME Public/Granted day:2012-09-06
Information query
IPC分类:
