Invention Grant
- Patent Title: Semiconductor device and communication method
- Patent Title (中): 半导体器件和通信方法
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Application No.: US13067548Application Date: 2011-06-08
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Publication No.: US08283770B2Publication Date: 2012-10-09
- Inventor: Yasutaka Nakashiba , Kenta Ogawa
- Applicant: Yasutaka Nakashiba , Kenta Ogawa
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2009-284350 20091215
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor module includes a semiconductor device including a mounting board, a semiconductor chip disposed at a first surface of the mounting board, a first inductor which is provided at a surface side of the semiconductor chip not facing the mounting board in order to perform communication between the semiconductor chip and the outside, a sealing resin layer which is formed at the first surface of the mounting board in order to seal the semiconductor chip, and a recess or an opening which is provided in the sealing resin layer and which includes the inductor inside when seen in a plan view; and a second inductor, which is located in the recess or the opening of the semiconductor device so that the second inductor performs communication with the first inductor.
Public/Granted literature
- US20110241165A1 Semiconductor device and communication method Public/Granted day:2011-10-06
Information query
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