A circuit board includes balls as electrodes in a grid, a power supply wiring pattern area connected to power supply terminals of an integrated circuit mounted thereon, and a feeding pattern area connected to a feeding point; the balls include first and second power supply ball groups connected respectively to power supply terminal arrays, at a predetermined interval, of the integrated circuit, and the power supply wiring pattern area includes first and second power supply connection patterns connected respectively to the first and second ball groups, and at least one connection pattern connecting the first and second power supply connection patterns noncontact to the balls, and has first and second connection portions connected respectively to the feeding pattern area and one electrode of a first bypass capacitor, and the second power supply connection pattern has a third connection portion connected to one electrode of a second bypass capacitor.