Invention Grant
- Patent Title: Differential delay compensation and measurement in bonded systems
- Patent Title (中): 粘结系统中的差分延迟补偿和测量
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Application No.: US11148556Application Date: 2005-06-09
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Publication No.: US08284795B2Publication Date: 2012-10-09
- Inventor: Miguel Peeters , Raphael Cassiers , Benoit M. S. Christiaens
- Applicant: Miguel Peeters , Raphael Cassiers , Benoit M. S. Christiaens
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04J3/16
- IPC: H04J3/16

Abstract:
A method for determining differential delay of at least two bonded links is described. The method comprises a step of providing, on the part of a transmitting entity, at least some of the data packets transmitted from the transmitting entity to a receiving entity with time stamps, the time stamps indicating a point of time when a respective data packet has been generated, and a step of deriving a propagation delay from a time stamp of a data packet and a time of arrival of the data packet at a receiving entity. The method further comprises a step of determining a differential delay of a link from the propagation delay of the link and a propagation delay of a reference link.
Public/Granted literature
- US20050286424A1 Differential delay compensation and measurement in bonded systems Public/Granted day:2005-12-29
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