Invention Grant
- Patent Title: Materials-based failure analysis in design of electronic devices
- Patent Title (中): 电子设备设计中基于材料的故障分析
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Application No.: US11698262Application Date: 2007-01-24
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Publication No.: US08285522B1Publication Date: 2012-10-09
- Inventor: Robert G. Tryon, III , Animesh Dey , Loren A. Nasser , Ganapathi Krishnan
- Applicant: Robert G. Tryon, III , Animesh Dey , Loren A. Nasser , Ganapathi Krishnan
- Applicant Address: US TN Brentwood
- Assignee: Vextec Corporation
- Current Assignee: Vextec Corporation
- Current Assignee Address: US TN Brentwood
- Agency: VLP Law Group LLP
- Agent Richard G. A. Bone
- Main IPC: G06F7/60
- IPC: G06F7/60 ; G06G7/62 ; G01B3/44 ; G01N19/00

Abstract:
The technology includes methods, a system, and a computer readable medium for predicting the failure of an electronic device during design of the device, by receiving data associated with the device, the data including data indicative of a device response to a specific load on the system while the device is in operation, and predicting potential failure of the device using a probabilistic model and the data, wherein the probabilistic model utilizes at least one of fast probability methods and simulation techniques.
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